High-speed multi-mode
WWAN module
in an LGA form-factor
- A wealth of connectivity
• High-speed data connectivity: 14.4Mbps downlink / 5.76Mbps uplink (HSPA)
• Highly-sensitive GPS connectivity
• PCM voice capability - Worldwide 2G/3G coverage
• Quad-band GSM/GPRS/EDGE
• Quad-band HSDPA/HSUPA
• Optional dual-band EV-DO
Due to its ultra-thin form factor and excellent heat dissipation characteristics this is the perfect module for integration in small consumer electronics devices or broadband M2M applications. The GPS, voice and optional EVDO capabilities give this module a unique position. The new and improved footprint facilitates soldering.