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Option NV
LGA GTM601 and GTM609 Due to its ultra-thin form factor and excellent heat dissipation characteristics this is the perfect module for integration in small consumer electronics devices or broadband M2M applications. The GPS voice and optional EVDO capabilities give this module a unique position. The new and improved footprint facilitates soldering.
High-speed multi-mode 3G modules compliant with GobiTM 3000 API
>A wealth of connectivity >High-speed data connectivity: 14.4Mbps downlink / 5.76Mbps uplink (HSPA) >Highly-sensitive GPS connectivity >Optional WiFi connectivity (½ size PCIe module) >PCM voice capability (½ size PCIe and LGA modules) >Worldwide 2G/3G coverage >Quad-band GSM/GPRS/EDGE >Quad/penta-band HSDPA/HSUPA >Optional triple-band EV-DO >All modules compliant with GobiTM 3000 API
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